A temperature and humidity chamber designed for electronic component testing is a critical piece of equipment used to simulate various environmental conditions. This advanced tool plays a pivotal role ...
A temperature and humidity chamber designed for electronic component testing is a critical piece of equipment used to simulate various environmental conditions. This advanced tool plays a pivotal role in assessing the performance, reliability, and durability of electronic components and devices under a range of thermal and moisture stresses. By replicating real-world environmental scenarios, these chambers help ensure that electronic products meet stringent quality and reliability standards.
In the rapidly evolving electronics industry, the reliability and longevity of components are paramount. Temperature and humidity chambers are instrumental in evaluating how electronic components respond to extreme temperature fluctuations and varying humidity levels. These chambers simulate conditions that electronic devices may encounter during transportation, storage, and operation, ensuring they perform optimally under adverse environmental conditions.
1. Precise Environmental Control: The chamber offers precise temperature control (-70°C to +180°C) and accurate humidity regulation (10% to 98% RH), enabling tests under various thermal and moisture stresses for insightful performance and durability assessments.
2. Uniform Condition Distribution: Advanced air circulation systems ensure consistent temperature and humidity throughout the test space, providing uniform environmental conditions for accurate results.
3. Rapid Condition Cycling: Quick transitions between temperature and humidity settings facilitate efficient testing cycles, crucial for evaluating components under abruptly changing real-world conditions.
4. Enhanced Product Reliability: Exposing components to various environmental stresses helps identify weaknesses, improving product reliability and reducing failure risks under real-world conditions.
5. User-Friendly Interface: An intuitive control panel or software interface allows easy setup, monitoring, and adjustment of testing parameters, enhancing the efficiency and accuracy of the testing process.
6. Comprehensive Data Logging: Real-time monitoring and post-test analysis capabilities provide detailed reports and insights into component behavior under different conditions.
7. Safety Features: Built-in safety mechanisms, such as over-temperature protection and automatic shut-offs, ensure safe operation and protect both equipment and users.
8. Industry Standards Compliance: The chambers meet industry-specific environmental testing standards (IEC, MIL, ASTM), ensuring regulatory compliance and facilitating product certification for various applications and markets.
9. Efficient Testing Process: Rapid condition cycling reduces testing time, increasing productivity and allowing more tests within a given timeframe, crucial for meeting tight development and production schedules.
10. Competitive Edge: By using temperature and humidity chambers, manufacturers can develop products that perform better and last longer under diverse environmental conditions, gaining a competitive edge in the market.
Model | DR-H201-100 | DR-H201-150 | DR-H201-225 | DR-H201-408 | DR-H201-800 | DR-H201-1000 |
Internal dimension | 400*500*500mm | 500*500*600mm | 500*600*750mm | 600*800*850mm | 1000*800*1000mm | 1000*1000*1000mm |
External dimension | 900*1070*1400mm | 1000*1070*1500mm | 1000*1170*1650mm | 1100*1370*1750mm | 1500*1180*1900mm | 1500*1380*1900mm |
Voltage(V) | Sigle Phase 220V | Sigle Phase 220V | Sigle Phase 220V | Three Phase 380V | Three Phase 380V | Three Phase 380V |
Temperature range | -20℃,-40℃,-70℃~150℃ | |||||
Temp.& Humi.Adjust Way | Balanced Temperature Humidity Control System(BTHC),Intelligent PID Regulation | |||||
Temperature fluctuations | ≤±0.7℃ (without load and temperature stable) | |||||
Internal Chamber Material | Stainless Steel 304 | |||||
External Chamber Material | Stainless steel or paint spray | |||||
Temperature uniformity | ≤±0.7℃ (without load and temperature stable) | |||||
Temperature deviation | ≤±1.0℃/ ±2.0℃ (without load and temperature stable) | |||||
Heating rate | 3℃/min in average | |||||
Cooling rate | 1℃/min in average | |||||
Humidity range | 20%~98%RH | |||||
Humidity deviation | 1 、≥75%RH:≤±3%RH ;2 、≤75%RH :≤±7%RH | |||||
Cooling Method | Single-stage compression,Second-stage Compression; | |||||
Refrigerator | Hermertically Sealed France Tecumseh Compressor or Semi-hermetic BOCK Compressor | |||||
Cooling Method | Air-cooled |
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